TECHNOLOGY
KEY FEATURES
Ultra small
Our nanoscale sensor structures are up to ten times smaller.
Current MEMS structures have feature sizes of one micron or larger while our NEMS (Nano Electro Mechanical Systems) structures
have features of 0.3 microns or less. This is a 100x area reduction.
Save space
A typical MEMS sensor package needs two chips - one for the MEMS structure and another for the control electronics, resulting in a package of 4mm3. As our NEMS sensor package has everything on one chip we can reduce the size by orders of magnitude.
Multi-sensor solutions​
Additional NEMS sensor structures can be added to the same chip with hardly any increase in size. These sensor structures would be similar in size and most of the control electronics is shared. This means that a multi-sensor solution is only slightly larger.
Unlimited production volumes
Our disruptive technology will revolutionize the semiconductor and silicon photonics sectors by removing the barrier to high volume production. We can use any CMOS fab and enjoy the cost-saving benefits of CMOS shrinking to smaller nodes.
