Nanusens’ patent pending technology enables MEMS nanostructures to be built within the layers of a CMOS chip using standard CMOS processes. This enables us to create both MEMS sensors and MEMS capacitors with the required control circuitry as innovative, single chip solutions that are significantly smaller than their current, multi-component equivalents. They can also be produced in virtually unlimited numbers in standard CMOS fabs, taking advantage of their low production cost.

MEMS Sensors — Many different sensors can be built into the same tiny chip to enhance the user experience and differentiate products without taking up more space. The freed-up space can be used for larger batteries for longer operational life battery or additional features. Its expertise and pending patents place it as the uncontested leader in this technology that will revolutionise the next generation of sensors. They are so small that they are actually nanosensors or NEMS.

MEMS Capacitors – Instead of needing a set of discrete capacitors on a PCB for the RF front end of 6G mobile phones, we can integrate our digitally tunable MEMScapacitors within the CMOS layers to form a single chip solution.